diff --git a/03-Architecture-Hardware/2026-09-02_Drogheda_v6-Copper-Plan_Placement-EMC-Guide.html b/03-Architecture-Hardware/2026-09-02_Drogheda_v6-Copper-Plan_Placement-EMC-Guide.html new file mode 100644 index 0000000..359ba29 --- /dev/null +++ b/03-Architecture-Hardware/2026-09-02_Drogheda_v6-Copper-Plan_Placement-EMC-Guide.html @@ -0,0 +1,217 @@ +
Placement companion for the 140 × 100 re-layout — every capacitor's owner, what clusters together, and the EMC order of work. Cap ownership below is computed from the board netlist, not from memory.
+ +ba70f62), and the sync re-nets P18/R126/C157 to a clean /NTC2. Tick “delete footprints with no symbol” in that dialog.Emission scales with the area of each switching current loop. A hot loop closed in 1 cm² is ~20 dB quieter than the same loop at 10 cm². Placement fixes this; routing can't rescue a bad placement.
A capacitor filters up to the frequency its trace inductance allows. Order banks by descending value toward the pin: bulk → 10 µF → 100 nF → pF, with the pF parts within 2–3 mm.
Four switchers, one LTE transmitter, one −167 dBm GNSS receiver on one board. Distance and an unbroken In1 ground plane are the only broadband shields you get for free.
Chain order along the copper, left to right from P1: F2 → Q23 (with R119, D33 beside its gate) → D32 SMCJ33A → input caps → U25 → D34/L22 → output caps. D10 stays glued to P1 pin 1.
C149/C150 within 2–3 mm of U25 pins 2/7, D34 directly across from them, and close the loop over solid ground. Under 1 cm² or do it again.| Ref | Value | Belongs to | Placement |
|---|---|---|---|
| C149 C150 | 2.2 µF/100 V | U25 VIN | 2–3 mm from pins 2/7; the hot loop |
| C151 | 100 µF/50 V | input bulk | right behind C149/C150 |
| C152 | 100 nF | U25 BOOT | directly across pins 1–8 |
| C153 C154 | 47 µF/16 V | 5 V output | at L22 output; FB tap (R121) here, not at the inductor |
| D34 | B560C | catch diode | anode ground ties straight into C149/C150 ground |
| D32 | SMCJ33A | surge clamp | between Q23 and the input caps, short fat ties |
| R120 · R123 C155 C156 · R121 R122 · R124 R125 | RT · COMP · FB · UVLO (DNP) | U25 analog side | cluster at pins 3–6, opposite the SW node; keep FB thin and away from L22 |
24 V rail housekeeping: C10/C22 bulk near Q10, C11 100 nF at the load side. Keep the whole entry block in one corner so the dirty 24 V copper never crosses the board.
| Ref | Value | Belongs to | Placement |
|---|---|---|---|
| C30 C31 C78 | 10 µF · 2.2 µF · 220 µF | VEH5V input | at U6 input pins, after RS1 |
| C32 C33 C34 | 47 µF ×2 · 10 µF | MAIN5V output | at U6/Q7 output side |
| C35 | 22 µF | BAT_PLUS | near P4; /SW_BAT ≥ 2 mm polygon, /BAT_PLUS ≥ 1.5 mm — the blackout path, a hard v6 requirement |
The VBAT bank is a one-direction gradient into pins 55/56/57 — largest farthest, smallest touching the module:
+| Ref | Value | Order | Placement |
|---|---|---|---|
| C130 C131 | 220 µF/10 V ×2 | far end | the ≥300 µF droop reservoir (2.8 A bursts, ≤300 mV sag) |
| C132 → C133 → C134 | 22 µF → 1 µF → 100 nF | middle | stepping toward the module |
| C135 C136 | 33 pF · 10 pF | at the pins | within 2–3 mm of pins 55/56/57 — these keep TX harmonics off VBAT |
| D22 | SMAJ5.0A | at the bank | across VBAT near C130/C131 |
VBAT copper ≥ 3 mm wide the whole way. Around the module: C125 at pin 15 (1V8 out); U22 SIM within 5 mm of pins 30–33 with C126 at its VCC pad and D23–D25 PESD at the SIM pads; U23/U24 level shifters between U19 and the MCU side, each with its supply pair (C137/C139 on 1V8, C138/C140 on 3V3) at the pins; Q20–Q22 near the control pins they drive. J13 U.FL at the board edge; the DNP pi network C146/C147 (+ its series element) sits inline in the 50 Ω run right at the connector, D28 ESD at the connector ground side.
| Ref | Value | Belongs to | Placement |
|---|---|---|---|
| C119 | 10 µF | U21 input (SW_5V) | at the LDO input pin |
| C120 C124 | 10 µF ×2 | 3V3_GNSS | one at U21 output, one at U18's main VCC entry |
| C121 C122 C123 | 100 nF ×3 | U18 VCC pins | one per supply pin, at the pin |
| C144 C145 | 100 nF · 100 pF | VCC_RF / bias tee | at L21's feed side — the antenna supply injection |
| C143 | 100 nF RF | DC block | inline in the 50 Ω run between L21 tap and J12 |
| D27 | ESD9L (≤0.5 pF) | J12 | at the connector, stub-less tap on the RF line |
This corner is the victim: no switcher, no inductor, no fast digital within ~25 mm; nothing but solid In1 ground under the module and the RF run. TIMEPULSE to the MCU is the one digital line that leaves — route it away from the RF path.
| Ref | Value | Belongs to | Placement |
|---|---|---|---|
| C111 | 4.7 µF | VCAP1 | ≤ 3 mm from the pin — the core regulator, non-negotiable |
| C109 C112 | 100 nF · 1 µF | VDDA | at the VDDA pin, on the quiet side, away from the switchers |
| C105–C108 + C110 | 100 nF ×4 + 4.7 µF | VDD pins | one 100 nF per VDD pin, bulk nearby |
| C104 | 100 nF | NRST | at the pin, with P10 reset routed clean |
| Y3 + C113 C114 | HSE + 15 pF | crystal | tight triangle at the pins, local ground, ≥10 mm from any inductor |
| Y4 + C115 C116 | LSE 32 kHz + 12 pF | crystal | even tighter — high-impedance oscillator, guard with ground |
| C5 C7 C9 C24 C157 | 100 nF ×5 | ADC sense filters | with their dividers (R42, R126…) at the MCU pins, not at the jacks — the wire filters at the pin |
U11/U12, Y1, C90–C103): one block, U11 close to J10 (magnetics are inside the HR911105A), crystal + 18 pF at the pins, the 3V3_ETH locals (C92–C94, C98, C102, C103) around U11. Keep the RJ45 pair region free of other routes.U15): C85–C88 are charge-pump flying caps — they carry the pump current, so they sit hard against U15; C84 100 nF at its supply pin. P16 at the edge.U10, Y2, C82/C83): crystal caps at the pins, block near the MCU.U2, Cbst1, Ccomp1, C23): a third switcher — treat like §4's loop, and park it in the noisy quarter near the power entry, away from GNSS.U26, C158/C159 at VDD/VDDIO, C160 bulk): ≤ 10 mm from a mounting hole, on stiff board — it should feel the chassis, not board flex.Cu3 Cu4 C80 C81 C89 C105+…): every 100 nF on 3V3 pairs with one IC's power pin — when you move an IC, its 100 nF moves with it. C118 22 µF is the 3V3 bulk at the regulator.R42+C24, R126+C157) at the MCU; P12/P18 jacks at the harness edge.| Keep apart | Min | Why |
|---|---|---|
| GNSS island ↔ any switcher L / SW node | 25 mm | −167 dBm receiver vs. dV/dt fields |
| GNSS RF run ↔ LTE RF run | opposite ends | desense is risk #1; antennas ≥ 20 cm at the enclosure |
| Any crystal ↔ any inductor | 10 mm | magnetic pickup into the oscillator |
| ADC sense traces ↔ SW nodes | 5 mm + ground between | tntc/vbat readings ride on µV |
| USB pairs (J9/J11) ↔ switchers | route as 90 Ω pairs, short | eye + radiated emissions |
| U26 accel ↔ mounting hole | ≤ 10 mm (close!) | chassis coupling, not board flex |
EinarBoard HBOX v6 · Helgen · generated 02-Sep-2026 from the live netlist (commit ba70f62).