1.1 Phase C8: outer GND pours + silkscreen tidy
- GND_POUR_FCU / GND_POUR_BCU zones added (full board, params mirror In2 plane: clearance 0.3, min 0.25, thermals 0.5/0.5); unfilled — press B in pcbnew - 164 reference designators re-placed at consistent spots (above-center preferred, below/left/right fallback), collision-checked vs pads/courtyards/vias/texts/edge; fonts normalized to 1.0mm/0.15 - 3 orphaned MOD1 pin labels (3V3/SW5V/GND) re-homed to the module's new position - verified: copper untouched (census 0 opens, clearance clean), non-silk content byte-identical
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